AI Data Center Liquid Cooling

Liquid cooling, from the chip to the whole system

KELVINS designs and builds cold plate and immersion liquid cooling for AI data centers. We start at the heat source and finish at the plant room: CDU, manifolds, quick-connect piping and leak-tight sealing, delivered as one system.

Three ways to move heat

Choose by rack density, room condition and how fast you need to be running.

Cold Plate

Cold plates mount directly on CPUs and GPUs and carry heat away at the source. The usual choice for GPU servers and for rooms originally built for air.

· Direct-to-chip heat capture
· Supports high-density racks
· Works with retrofit

Cold plate detail

Immersion

Boards sit in dielectric fluid. Heat moves into the fluid and out through a modular CDU, with flexible quick-connect piping and full-system leak protection.

· Modular CDU
· Quick-connect piping
· Sealed, leak-tight system

Immersion detail

Air-to-Liquid Retrofit

An existing air-cooled room can be converted without rebuilding the shell. Racks move from the 8–15 kW range to well above 100 kW.

· No structural rebuild
· Short conversion window
· Fast payback

Check your room

Why customers pick KELVINS

PUE < 1.1

Cold plate designs reach PUE below 1.1, against roughly 1.4–1.5 for conventional air cooling.

200–3000 kW

Intelligent CDU range covers a single row up to a full hall.

Simulation first

Every project starts with simulation, then industrial design, then test validation.

One chain

Design, manufacture and commissioning handled by the same team that owns the result.

How a project runs

1

Simulation

Model the thermal load before anything is ordered, so the design rests on your real numbers.

2

Industrial design

Layout, manifolds and piping designed for the room you actually have.

3

Test validation

Leak, flow and thermal testing before the system is handed over.

Which approach fits your room?

Send rack count, current density and room constraints. We come back with a recommendation, not a brochure.

Contact KELVINS